SIM Card Connector,PUSH PUSH,8P+1P,H1.9mm,with Post

Material:
Housing:Hi-Temp Plastic,UL94V-0.Rated.
Contact:Copper Alloy.
Shell:Copper Alloy.

Plating:
Contact Area:Gold flash.
Solder area:80u” Min,Matte tin alloy plated.
Under plate:30u” min,Nickel.
Shell:30u” Min,Nickel plated overall
Solder area:Gole flash.

Electrical:
Current Rating:0.5A.
Withstanding Voltage:AC500V r.m.s.
Insulation Resistance:1000MΩMin,At DC 500V
Contact Resistance:100mΩ Max.
Mating Cycles:3000 Insertions.
Operating Temperature: -45ºC~+85ºC

KLS1-SIM-108-8P.pdf