Micro SD card connector push push,H1.85mm,with CD pin

Material:
Insulator:High Temperature Thermoplastic,LCP,UL94V-0.
Contact:Copper Alloy T=0.15,Plated 50u” Ni Overall.
Plated Au Selective Contact Area Plated 30u”-70u” Sn Over Ni On Solder Area.
Shell:T=0.15,Plated 30u” Ni Overall min. Plated 0.5u” Au Selective ContactArea

Electrical:
Current Rating:0.5mA amx.
Voltage Rating:3.3V
Ambient Humidity Range:95% R.H. Max.
Contact Resistance:100mΩ Max.
Insulation Resistance:1000MΩ Min./500VDC
Mating Cycles:5000 Insertions.
Operating Temperature: -45ºC~+105ºC

KLS1-TF-003D.pdf