Micro SD 4.0 card connector push push,H1.3mm

Material:
Insulator:Thermal Plastic,Pated UL94V-0.
Contacts:Phosphor Bronze.
Shell:Stainless steel.
Contact Plating:
Underplate:50u”-100u” Nickel
Contact area:Gold Flash
Solder tails area:100u”-200u” Tin
Electrical:
Operating Voltage:10V
Current Rating:0.5A Min.
Contact Resistance:100mΩ Max.
Insulation Resistance:1000MΩ
Dielectric Withstanding Voltage:500VAC/1 Minute.

Mating Cycles:3000 insertions

KLS1-SD4.0-003.pdf