| Electrical performance |
| 1 |
Contact impedance |
30 mohm Max at working stroke |
Top-Link factory testing standard* |
| 2 |
Insulation Resistance |
500 Mohm Min |
EIA-364-21 |
| 3 |
Dielectric Withstanding Voltage |
No flash-over,air discharge,breakdown or leakage |
EIA-364-20 |
| 4 |
Temperature Rise vs Current Rating |
30 °C Max.
temperature rise at specified current |
EIA-364-70 |
| Mechanical performance |
| 1 |
Spring force |
refer to product drawing |
EIA-364-04 |
| 2 |
Retention Force |
0.5Kgf(4.5N)Min. |
EIA-364-29 |
| 3 |
Durability |
10,000 cycles Min.
No physical damage Resistance after test 30 mohm Max. |
EIA-364-09 |
| 4 |
Vibration |
No physical damage,No electrical discontinuity more than 1i second. |
EIA-364-28 |
| 5 |
Mechanical Shock |
No physical damage,No electrical discontinuity more than 1i second. |
EIA-364-27 method A |
| Environmental |
| 1 |
Solderability |
solder coverage area Min.95% |
EIA-364-52 |
| 2 |
Salt Spray Corrosion |
No physical damage. Resistance after test 100 mohm Max. |
EIA-364-26 condition B |
| 3 |
Resistance to Solder heat(IR/convection) |
No cracks,chips,melting,orblister |
EIA-364-56 |
| 4 |
Humidity |
No physical damage, Resistance after test 100 mohm Max. |
EIA-364-31,method ii,condition A |
| 5 |
Thermal Shock |
No physical damage, Resistance after test 100 mohm Max. |
EIA-364-32,method ii |
| 6 |
Temperature Life |
No physical damage, Resistance after test 100 mohm Max. |
EIA-364-17,condition A,condition 4 |
| Environmental |
| 1 |
peel force |
10-130 gf |
EIA-481 |
| 2 |
Drop Test |
|
Refer to drop test Standard of Molex |
